JPH0260217B2 - - Google Patents

Info

Publication number
JPH0260217B2
JPH0260217B2 JP61262915A JP26291586A JPH0260217B2 JP H0260217 B2 JPH0260217 B2 JP H0260217B2 JP 61262915 A JP61262915 A JP 61262915A JP 26291586 A JP26291586 A JP 26291586A JP H0260217 B2 JPH0260217 B2 JP H0260217B2
Authority
JP
Japan
Prior art keywords
gate
layer
dielectric layer
photoresist
self
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61262915A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62136883A (ja
Inventor
Gurafu Fuorukaa
Oosenburutsuku Aruberutasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS62136883A publication Critical patent/JPS62136883A/ja
Publication of JPH0260217B2 publication Critical patent/JPH0260217B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/061—Manufacture or treatment of FETs having Schottky gates
    • H10D30/0612—Manufacture or treatment of FETs having Schottky gates of lateral single-gate Schottky FETs
    • H10D30/0614—Manufacture or treatment of FETs having Schottky gates of lateral single-gate Schottky FETs using processes wherein the final gate is made after the completion of the source and drain regions, e.g. gate-last processes using dummy gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/017—Manufacture or treatment using dummy gates in processes wherein at least parts of the final gates are self-aligned to the dummy gates, i.e. replacement gate processes

Landscapes

  • Junction Field-Effect Transistors (AREA)
JP61262915A 1985-12-06 1986-11-06 自己整合電界効果トランジスタの製造方法 Granted JPS62136883A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP85115572A EP0224614B1 (en) 1985-12-06 1985-12-06 Process of fabricating a fully self- aligned field effect transistor
EP85115572.1 1985-12-06

Publications (2)

Publication Number Publication Date
JPS62136883A JPS62136883A (ja) 1987-06-19
JPH0260217B2 true JPH0260217B2 (en]) 1990-12-14

Family

ID=8193926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61262915A Granted JPS62136883A (ja) 1985-12-06 1986-11-06 自己整合電界効果トランジスタの製造方法

Country Status (4)

Country Link
US (1) US4728621A (en])
EP (1) EP0224614B1 (en])
JP (1) JPS62136883A (en])
DE (1) DE3576610D1 (en])

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199068A (ja) * 1986-02-27 1987-09-02 Toshiba Corp 半導体装置及びその製造方法
JPS6362272A (ja) * 1986-09-02 1988-03-18 Seiko Instr & Electronics Ltd 半導体装置の製造方法
US4792531A (en) * 1987-10-05 1988-12-20 Menlo Industries, Inc. Self-aligned gate process
US4863879A (en) * 1987-12-16 1989-09-05 Ford Microelectronics, Inc. Method of manufacturing self-aligned GaAs MESFET
JP2685149B2 (ja) * 1988-04-11 1997-12-03 住友電気工業株式会社 電界効果トランジスタの製造方法
JPH0748502B2 (ja) * 1988-05-13 1995-05-24 三菱電機株式会社 半導体装置の製造方法
WO1990002215A1 (en) * 1988-08-19 1990-03-08 Regents Of The University Of Minnesota Preparation of superconductive ceramic oxides using ozone
KR910005400B1 (ko) * 1988-09-05 1991-07-29 재단법인 한국전자통신연구소 다층레지스트를 이용한 자기정합형 갈륨비소 전계효과트랜지스터의 제조방법
US5196379A (en) * 1988-09-19 1993-03-23 Regents Of The University Of Minneapolis Method of depositing oxide passivation layers on high temperature superconductors
US4965244A (en) * 1988-09-19 1990-10-23 Regents Of The University Of Minnesota CaF2 passivation layers for high temperature superconductors
DE59009067D1 (de) * 1990-04-27 1995-06-14 Siemens Ag Verfahren zur Herstellung einer Öffnung in einem Halbleiterschichtaufbau und dessen Verwendung zur Herstellung von Kontaktlöchern.
KR940007668B1 (ko) * 1991-12-26 1994-08-22 재단법인 한국전자통신연구소 갈륨비소 금속반도체 전계효과 트랜지스터의 제조방법
US5520785A (en) * 1994-01-04 1996-05-28 Motorola, Inc. Method for enhancing aluminum nitride
JP2606581B2 (ja) * 1994-05-18 1997-05-07 日本電気株式会社 電界効果トランジスタ及びその製造方法
DE19530050C2 (de) * 1995-08-16 2003-04-10 Daimler Chrysler Ag Selbstjustierendes Verfahren zur Herstellung von Feldeffekttransistoren
US5858843A (en) * 1996-09-27 1999-01-12 Intel Corporation Low temperature method of forming gate electrode and gate dielectric
KR19980078235A (ko) * 1997-04-25 1998-11-16 문정환 반도체 소자의 제조 방법
US5866934A (en) * 1997-06-20 1999-02-02 Advanced Micro Devices, Inc. Parallel and series-coupled transistors having gate conductors formed on sidewall surfaces of a sacrificial structure
US6117741A (en) * 1998-01-09 2000-09-12 Texas Instruments Incorporated Method of forming a transistor having an improved sidewall gate structure
US6548362B1 (en) * 1998-05-22 2003-04-15 Texas Instruments-Acer Incorporated Method of forming MOSFET with buried contact and air-gap gate structure
US6501138B1 (en) * 1999-04-16 2002-12-31 Seiko Epson Corporation Semiconductor memory device and method for manufacturing the same
AU2003258933A1 (en) * 2003-09-05 2005-03-29 Amds Ab Method and device
DE102004025610A1 (de) 2004-04-30 2005-11-17 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit mehreren Stromaufweitungsschichten und Verfahren zu dessen Herstellung
WO2007116238A1 (en) * 2006-04-11 2007-10-18 Picogiga METHOD OF MANUFACTURING A GaN MOSFET
CN114068706B (zh) * 2020-07-31 2023-12-29 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58130575A (ja) * 1982-01-29 1983-08-04 Hitachi Ltd 電界効果トランジスタの製造方法
JPS58201362A (ja) * 1982-05-20 1983-11-24 Toshiba Corp 半導体装置の製造方法
US4561169A (en) * 1982-07-30 1985-12-31 Hitachi, Ltd. Method of manufacturing semiconductor device utilizing multilayer mask
JPS5950567A (ja) * 1982-09-16 1984-03-23 Hitachi Ltd 電界効果トランジスタの製造方法
US4505023A (en) * 1982-09-29 1985-03-19 The United States Of America As Represented By The Secretary Of The Navy Method of making a planar INP insulated gate field transistor by a virtual self-aligned process
JPS5999717A (ja) * 1982-11-29 1984-06-08 Fujitsu Ltd 半導体装置の製造方法
JPS59114871A (ja) * 1982-12-21 1984-07-03 Toshiba Corp シヨツトキ−ゲ−ト型ＧａＡｓ電界効果トランジスタの製造方法
JPS59138379A (ja) * 1983-01-27 1984-08-08 Toshiba Corp 半導体装置の製造方法
US4519127A (en) * 1983-02-28 1985-05-28 Tokyo Shibaura Denki Kabushiki Kaisha Method of manufacturing a MESFET by controlling implanted peak surface dopants
JPS59229876A (ja) * 1983-06-13 1984-12-24 Toshiba Corp シヨツトキ−ゲ−ト型電界効果トランジスタの製造方法
JPS6032364A (ja) * 1983-08-01 1985-02-19 Toshiba Corp 半導体装置の製造方法
US4512073A (en) * 1984-02-23 1985-04-23 Rca Corporation Method of forming self-aligned contact openings

Also Published As

Publication number Publication date
JPS62136883A (ja) 1987-06-19
EP0224614B1 (en) 1990-03-14
DE3576610D1 (de) 1990-04-19
US4728621A (en) 1988-03-01
EP0224614A1 (en) 1987-06-10

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